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| 2N7002 DMOS Transistors (N-Channel) SOT-23 .122 (3.1) .118 (3.0) .016 (0.4) 3 FEATURES Top View .056 (1.43) .052 (1.33) 1 2 max. .004 (0.1) .007 (0.175) .005 (0.125) .037(0.95) .037(0.95) .045 (1.15) .037 (0.95) High input impedance High-speed switching No minority carrier storage time CMOS logic compatible input No minority carrier storage time CMOS logic compatible input No thermal runaway No secondary breakdown .016 (0.4) .016 (0.4) .102 (2.6) .094 (2.4) MECHANICAL DATA Case: SOT-23 Plastic Package Weight: approx. 0.008 g Marking S72 Dimensions in inches and (millimeters) Pin configuration 1 = Gate, 2 = Source, 3 = Drain MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 C ambient temperature unless otherwise specified Symbol Drain-Source Voltage Drain-Gate Voltage Gate-Source-Voltage (pulsed) Drain Current (continuous) Power Dissipation at TC = 50 C Junction Temperature Storage Temperature Range 1) Value 60 60 20 250 0.3101) 150 -55 to +150 Unit V V V mA W C C VDSS VDGS VGS ID Ptot Tj TS Ceramic Substrate 0.7mm; 2.5 cm2 area. Inverse Diode Symbol Max. Forward Current (continuous) at Tamb = 25 C Forward Voltage Drop (typ.) at VGS = 0, IF = 0.3 A, Tj = 25 C 4/98 Value 0.3 0.85 Unit A V IF VF 2N7002 ELECTRICAL CHARACTERISTICS Ratings at 25 C ambient temperature unless otherwise specified Symbol Drain-Source Breakdown Voltage at ID = 100 A, VGS = 0 Gate Threshold Voltage at VGS = VDS, ID = 1 mA Gate-Body Leakage Current at VGS = 15 V, VDS = 0 Drain Cutoff Current at VDS = 25 V, VGS = 0 Drain-Source ON Resistance at VGS = 10 V, ID = 500 mA Thermal Resistance Junction to Substrate Backside Thermal Resistance Junction to Ambient Air Forward Transconductance at VDS = 10 V, ID = 200 mA, f = 1 MHz Input Capacitance at VDS = 10 V, VGS = 0, f = 1 MHz Switching Times at VGS = 10 V, VDS = 10 V, RD = 100 Turn-On Time Turn-Off Time 1) Min. 60 - - - - - - - - Typ. 90 2 - - 5 - - 200 60 Max. - 2.5 10 0.5 7.5 3201) 4501) - - Unit V V nA A K/W K/W mS pF V(BR)DSS VGS(th) IGSS IDSS rDS(ON) RthSB RthJA gm Ciss ton toff - - 5 25 - - ns ns Device on fiberglass substrate, see layout .30 (7.5) .12 (3) .04 (1) .08 (2) .04 (1) .08 (2) .59 (15) .47 (12) .03 (0.8) 0.2 (5) .06 (1.5) .20 (5.1) Dimensions in inches (millimeters) Layout for RthJA test Thickness: Fiberglass 0.059 in (1.5 mm) Copper leads 0.012 in (0.3 mm) RATINGS AND CHARACTERISTIC CURVES 2N7002 RATINGS AND CHARACTERISTIC CURVES 2N7002 RATINGS AND CHARACTERISTIC CURVES 2N7002 |
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